Electro-thermal and logi-thermal simulation of VLSI designs

Szekely, V. ; Poppe, A. ; Pahi, A. ; Csendes, A. ; Hajas, G. ; Rencz, M.

IEEE transactions on very large scale integration (VLSI) systems, 1997-09, Vol.5 (3), p.258-269 [Periódico revisado por pares]

Piscataway, NJ: IEEE

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