Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects
Chia, Pay Ying ; Haseeb, A S M A ; Mannan, Samjid Hassan
Materials, 2016-05, Vol.9 (6), p.430-430
[Periódico revisado por pares]
Switzerland: MDPI AG
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