Lead-Free Solder Joint Void Evolution During Multiple Subsequent High-Temperature Reflows
Yan Li ; Moore, J. S. ; Pathangey, B. ; Dias, R. C. ; Goyal, D.
IEEE transactions on device and materials reliability, 2012-06, Vol.12 (2), p.494-500 [Periódico revisado por pares]New York: IEEE
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