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Unified Mechanics of Metals under High Electrical Current Density: Electromigration and Thermomigration
Basaran, Cemal
Introduction to Unified Mechanics Theory with Applications, 2021, p.395-425
Switzerland: Springer International Publishing AG
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Título:
Unified Mechanics of Metals under High Electrical Current Density: Electromigration and Thermomigration
Autor:
Basaran, Cemal
Assuntos:
Atomic vacancy
;
Concentration gradient
;
Current density
;
Diffusion
;
Electromigration
;
Electron wind forces
;
Electronics
;
Entropy
;
Failure in electronics
;
Stress gradient
;
Thermodynamics
;
Thermomigration
;
Thermophoresis
;
Unified mechanics theory
;
Void
É parte de:
Introduction to Unified Mechanics Theory with Applications, 2021, p.395-425
Descrição:
Electromigration and thermomigration are in principal irreversible mass diffusion mechanisms under high current density and high temperature gradient, respectively. However, thermomigration can take place alone in the absence of electrical current, while electromigration cannot happen without thermomigration due to Joule heating, except for special circumstances. When a solid conductor (metal) is subjected to an electrical potential gradient, the current enters from the anode side and travels to the cathode side, and the electrons travel from the cathode to the anode side. Electromigration is a mass diffusion-controlled phenomenon. When a conductor is subject to a high current density, the so-called electron wind transfer part of the momentum to the atoms (or ions) to make the atoms (or ions) moves in the direction of the current. As a result, the degradation of the conductor occurs mainly in two forms: in the anode side, the atoms will accumulate and finally form hillocks, and the vacancy concentration in the cathode side will form voids. Both hillocks and voids will cause the degradation of the material and eventual failure. The damage evolution due to electromigration can be modeled as an irreversible mass transport process. The purpose of this chapter is to present the formulation of modeling the electromigration- and thermomigration-induced material degradation process using the unified mechanics theory.
Editor:
Switzerland: Springer International Publishing AG
Idioma:
Inglês
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