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Strain Engineering of 2D Materials: Issues and Opportunities at the Interface

Dai, Zhaohe ; Liu, Luqi ; Zhang, Zhong

Advanced materials (Weinheim), 2019-11, Vol.31 (45), p.e1805417-n/a [Periódico revisado por pares]

Germany: Wiley Subscription Services, Inc

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  • Título:
    Strain Engineering of 2D Materials: Issues and Opportunities at the Interface
  • Autor: Dai, Zhaohe ; Liu, Luqi ; Zhang, Zhong
  • Assuntos: 2D materials ; adhesion ; Engineering ; interface ; Interfacial properties ; nanomechanics ; Photonics ; Semiconductor devices ; Semiconductor materials ; Strain ; strain engineering ; Substrates ; Two dimensional materials
  • É parte de: Advanced materials (Weinheim), 2019-11, Vol.31 (45), p.e1805417-n/a
  • Notas: ObjectType-Article-2
    SourceType-Scholarly Journals-1
    ObjectType-Feature-3
    content type line 23
    ObjectType-Review-1
  • Descrição: Triggered by the growing needs of developing semiconductor devices at ever‐decreasing scales, strain engineering of 2D materials has recently seen a surge of interest. The goal of this principle is to exploit mechanical strain to tune the electronic and photonic performance of 2D materials and to ultimately achieve high‐performance 2D‐material‐based devices. Although strain engineering has been well studied for traditional semiconductor materials and is now routinely used in their manufacturing, recent experiments on strain engineering of 2D materials have shown new opportunities for fundamental physics and exciting applications, along with new challenges, due to the atomic nature of 2D materials. Here, recent advances in the application of mechanical strain into 2D materials are reviewed. These developments are categorized by the deformation modes of the 2D material–substrate system: in‐plane mode and out‐of‐plane mode. Recent state‐of‐the‐art characterization of the interface mechanics for these 2D material–substrate systems is also summarized. These advances highlight how the strain or strain‐coupled applications of 2D materials rely on the interfacial properties, essentially shear and adhesion, and finally offer direct guidelines for deterministic design of mechanical strains into 2D materials for ultrathin semiconductor applications. The strain engineering of 2D materials is particularly exciting, because an individual sheet can survive remarkably large mechanical strain and its atomic thinness allows mechanical deformations like a piece of paper. These exceptional circumstances create opportunities for the study of new fundamental physics and applications of 2D materials emerging at the large strain level.
  • Editor: Germany: Wiley Subscription Services, Inc
  • Idioma: Inglês
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