skip to main content
Idioma:

Low temperature electromigration and thermomigration in lead-free solder joints

Hamid, Mohd Foad Abdul ; Basaran, Cemal

2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2008, p.1-6

IEEE

Texto completo disponível

Citações Citado por
  • Título:
    Low temperature electromigration and thermomigration in lead-free solder joints
  • Autor: Hamid, Mohd Foad Abdul ; Basaran, Cemal
  • Assuntos: Current density ; Electromigration ; Electrons ; Environmentally friendly manufacturing techniques ; Lead ; Passivation ; Soldering ; Temperature ; Testing ; Thermal force
  • É parte de: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT), 2008, p.1-6
  • Descrição: High current density and high temperature gradient are major reliability concern for next generation high density power electronics. High current density experiments on lead free solder joints coated with NiAu and non-coated Cu pads were conducted at -20°C, -30°C, -40°C and -50°C ambient temperatures. The time to failure (TTF) shows that solder joints with NiAu coated Cu pads last longer. Results also indicates TTF plot shows that TTF rate increases exponentially when the solder joint temperature is higher than 64% of its melting temperature, and decreases exponentially reaching the maximum lifetime when the temperature is below this threshold temperature. The mass transport activation energy, E a was determined using the test data and it was found to be 2.67 ± 0.05 and 3.65 ± 0.13 eV for coated and non-coated solder joints, respectively. These values are indicative of the dominant diffusion mechanism during the experiment. It was discovered that the thermomigration driving force was as high as electromigration driving force.
  • Editor: IEEE
  • Idioma: Inglês
Voltar para lista de resultados
Ir para página anteriorAnterior Resultado  9 AvançarIr para próxima página

  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

Buscando em bases de dados remotas. Favor aguardar.