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Advancing electronic packaging, one solder joint at a time

R & D, 2003-10, Vol.45 (10), p.10

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Título:
Advancing electronic packaging, one solder joint at a time
Assuntos: Colleges & universities ; Innovations ; Integrated circuits ; Microelectronics ; R&D ; Research & development
É parte de: R & D, 2003-10, Vol.45 (10), p.10
Notas: content type line 24
ObjectType-News-1
SourceType-Magazines-1
Descrição: The activity within microelectronics has centered around two main problems: 1. making IC's faster and 2. creating smaller, more reliable packaging. A group from the Univ of Buffalo, NY, headed by Cemal Basaran and Alexander Cartwright, are addressing these issues by targeting solder joints as a field for innovation.
Editor: Cleveland: Advantage Business Media
Idioma: Inglês

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