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Sacrificial adhesive bonding: a powerful method for fabrication of glass microchips

Lima, Renato S ; Leão, Paulo A G C ; Piazzetta, Maria H O ; Monteiro, Alessandra M ; Shiroma, Leandro Y ; Gobbi, Angelo L ; Carrilho, Emanuel

Scientific reports, 2015-08, Vol.5 (1), p.13276-13276, Article 13276 [Periódico revisado por pares]

England: Nature Publishing Group

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  • Título:
    Sacrificial adhesive bonding: a powerful method for fabrication of glass microchips
  • Autor: Lima, Renato S ; Leão, Paulo A G C ; Piazzetta, Maria H O ; Monteiro, Alessandra M ; Shiroma, Leandro Y ; Gobbi, Angelo L ; Carrilho, Emanuel
  • Assuntos: Adhesive bonding ; Integrated circuits ; Integration ; Semiconductors ; Surface properties ; Temperature effects
  • É parte de: Scientific reports, 2015-08, Vol.5 (1), p.13276-13276, Article 13276
  • Notas: ObjectType-Article-1
    SourceType-Scholarly Journals-1
    ObjectType-Feature-2
    content type line 23
  • Descrição: A new protocol for fabrication of glass microchips is addressed in this research paper. Initially, the method involves the use of an uncured SU-8 intermediate to seal two glass slides irreversibly as in conventional adhesive bonding-based approaches. Subsequently, an additional step removes the adhesive layer from the channels. This step relies on a selective development to remove the SU-8 only inside the microchannel, generating glass-like surface properties as demonstrated by specific tests. Named sacrificial adhesive layer (SAB), the protocol meets the requirements of an ideal microfabrication technique such as throughput, relatively low cost, feasibility for ultra large-scale integration (ULSI), and high adhesion strength, supporting pressures on the order of 5 MPa. Furthermore, SAB eliminates the use of high temperature, pressure, or potential, enabling the deposition of thin films for electrical or electrochemical experiments. Finally, the SAB protocol is an improvement on SU-8-based bondings described in the literature. Aspects such as substrate/resist adherence, formation of bubbles, and thermal stress were effectively solved by using simple and inexpensive alternatives.
  • Editor: England: Nature Publishing Group
  • Idioma: Inglês
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  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

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