A hermetic glass-silicon micropackage with high-density on-chip feedthroughs for sensors and actuators
Ziaie, B. ; Von Arx, J.A. ; Dokmeci, M.R. ; Najafi, K.
Journal of microelectromechanical systems, 1996-09, Vol.5 (3), p.166-179 [Periódico revisado por pares]New York, NY: IEEE
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