Quantifying the subsurface damage and residual stress in ground silicon wafer using laser ultrasonic technology: A Bayesian approach

Liu, Zaiwei ; Lin, Bin ; Liang, Xiaohu ; Du, Anyao

Mechanical systems and signal processing, 2022-07, Vol.173, p.109008, Article 109008 [Periódico revisado por pares]

Berlin: Elsevier Ltd

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