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Boosting thermoelectric performance in Cu3SbS4-based compounds through incorporating SiC nanoparticles

Zhang, Dewei ; Hui, Yitao ; Cai, Junyao ; Zhang, Manlin ; Xu, Jianguang ; Zhang, Qinfang

Journal of materials science. Materials in electronics, 2022-03, Vol.33 (8), p.5214-5223 [Periódico revisado por pares]

New York: Springer US

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  • Título:
    Boosting thermoelectric performance in Cu3SbS4-based compounds through incorporating SiC nanoparticles
  • Autor: Zhang, Dewei ; Hui, Yitao ; Cai, Junyao ; Zhang, Manlin ; Xu, Jianguang ; Zhang, Qinfang
  • Assuntos: Additives ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Materials Science ; Nanoparticles ; Optical and Electronic Materials ; Power factor ; Scattering ; Thermal conductivity ; Thermoelectric materials ; Waste heat recovery
  • É parte de: Journal of materials science. Materials in electronics, 2022-03, Vol.33 (8), p.5214-5223
  • Descrição: Cu 3 SbS 4 -based compounds have received significant attention as a promising alternative for p-type thermoelectric materials due to their low-cost, earth abundant resource, and eco-friendly characteristics. However, the practical applications for waste heat utilization and solid-state refrigeration are still limited because of their low conversion efficiency. Herein, a high thermoelectric performance was realized in SiC nanoparticles-dispersed Cu 3 Sb 0.85 Bi 0.06 Sn 0.05 S 4 composites. SiC nanoparticles additives generate the interface potential barriers and increased energy-dependent carrier scattering, leading to enhanced power factor. Moreover, SiC nanoparticles significantly reduces the lattice thermal conductivity due to enhanced phonon scattering. As a result, a high ZT value of 0.61 is achieved at 573 K for the CASBT/0.05 wt % SiC sample, which is enhanced by 39% compared with the pristine sample. Meanwhile, an outstanding average ZT of 0.31 is obtained among the investigated temperature range. This work provides a feasible guidance for designing advanced thermoelectric materials.
  • Editor: New York: Springer US
  • Idioma: Inglês
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  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

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