Boosting thermoelectric performance in Cu3SbS4-based compounds through incorporating SiC nanoparticles

Zhang, Dewei ; Hui, Yitao ; Cai, Junyao ; Zhang, Manlin ; Xu, Jianguang ; Zhang, Qinfang

Journal of materials science. Materials in electronics, 2022-03, Vol.33 (8), p.5214-5223 [Periódico revisado por pares]

New York: Springer US

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