Intermetallic reactions in a sn-511n solder bga package with immersion ag surface finish

Jain, Chao-Chi ; Wang, Shiuan-Sheng ; Wu, Hui-Min ; Chuang, Tung-Han

Journal of the Chinese Institute of Engineers, 2009-03, Vol.32 (2), p.229-234 [Periódico revisado por pares]

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