How to Manipulate Warpage in Fan-out Wafer and Panel Level Packaging
Braun, Tanja ; Holck, Ole ; Adler, Marius ; Obst, Mattis ; Voges, Steve ; Becker, Karl-Friedrich ; Aschenbrenner, Rolf ; Voitel, Marcus ; Dreissigacker, Marc ; Schneider-Ramelow, Martin
2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.1-6IEEE
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