Process and equipment simulation of dry silicon etching in the absence of ion bombardment

Otto, T. ; Wolf, H. ; Streiter, R. ; Dehoff, A. ; Wandel, K. ; Gessner, T.

Microelectronic engineering, 1999-08, Vol.45 (4), p.377-391 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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