Extra-pattern killer defectivity improvement and enhancement of within-feature barrier coverage by optimization of TaN barrier PVD process in 90p Cu wire interconnects for 28nm technology

Rajagopalan, Balajee ; Laloe, Jean-Baptiste ; Silvestre, Mary Claire ; Ramanathan, Eswar ; Khanal, Sohana ; Laval, Alain ; Ge, Qian ; Takahashi, Nobuyuki ; Mahalingam, Anbu Selvam ; Liew, San Leong ; Teagle, Robert

2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2016, p.354-357 [Periódico revisado por pares]

IEEE

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