Idioma:

Novel Ballistic Processing of Sn-0.7Cu Thick Films

Cavero, D. ; Stewart, K. ; Morsi, K.

Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2017-01, Vol.48 (1), p.46-50 [Periódico revisado por pares]

Texto completo disponível

Citações Citado por

Título:
Novel Ballistic Processing of Sn-0.7Cu Thick Films
Autor: Cavero, D. ; Stewart, K. ; Morsi, K.
Assuntos: Ballistics ; Characterization and Evaluation of Materials ; Chemistry and Materials Science ; Communication ; Materials Science ; Metallic Materials ; Nanotechnology ; Structural Materials ; Surfaces and Interfaces ; Thickness measurement ; Thin Films
É parte de: Metallurgical and materials transactions. A, Physical metallurgy and materials science, 2017-01, Vol.48 (1), p.46-50
Descrição: The present paper discusses a novel process (Ballistic Processing) for the ultra-rapid processing of textured and un-textured thick and potentially thin films. The effect of processing velocity (14.6 to 36.1 m/s) on the developed external structure and internal microstructure of Sn-0.7Cu thick film is discussed. Film thicknesses ranging from 6.08 to 12.79 μ m were produced and characterized by two-dimensional hypoeutectic microstructures. Both film thickness and dendrite arm spacing decreased with an increase in processing velocity.
Editor: New York: Springer US
Idioma: Inglês

Voltar para lista de resultados

Anterior Resultado 4 Avançar Ir para próxima página