Thermal resistance-capacitance network model for fast simulation on the desiccant coated devices used for effective electronic cooling

Liu, H.R. ; Hua, L.J. ; Li, B.J. ; Wang, C.X. ; Wang, R.Z.

International journal of refrigeration, 2021-11, Vol.131, p.78-86 [Periódico revisado por pares]

Paris: Elsevier B.V

Texto completo disponível