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Residual stress in composite film (Ni–Co–P/Si 3N 4)

Hiratsuka, Kouichi ; Takago, Shigeki ; Sasaki, Toshihiko ; Hirose, Yukio

Thin solid films, 2001-11, Vol.398, p.476-479 [Periódico revisado por pares]

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Título:
Residual stress in composite film (Ni–Co–P/Si 3N 4)
Autor: Hiratsuka, Kouichi ; Takago, Shigeki ; Sasaki, Toshihiko ; Hirose, Yukio
Assuntos: Composite material ; Elastic constant ; Nickel ; Phase stress ; Plating ; Residual stress ; X-Ray diffraction
É parte de: Thin solid films, 2001-11, Vol.398, p.476-479
Notas: ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
Descrição: A Ni–Co–P alloy containing a particle composite plating material of Si 3N 4 consists of metal and ceramic and is called a metal matrix composite. Residual macro- and microstress are generated due to the misfit of the mechanical properties. Since residual stress affects the strength of materials, it is necessary to evaluate the micro- and microstress accurately. The influences of the volume fraction and grain size of Si 3N 4 on the residual stress in both the matrix and the inclusion phase were investigated. The effect of the film thickness in the phase stress was also examined. X-Ray data from both phases were used to verify that a relationship existed between plating conditions and the residual stress. Strains in the individual phases were measured using an X-ray diffraction technique. Phase stress was determined by using the X-ray elastic constants.
Editor: Elsevier B.V
Idioma: Inglês

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