Interfacial bonding mechanism and fracture behavior in ultrasonic spot welding of copper sheets

Ni, Z.L. ; Liu, Y. ; Wang, Y.H. ; He, B.Y.

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2022-01, Vol.833, p.142536, Article 142536 [Periódico revisado por pares]

Lausanne: Elsevier B.V

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