LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults
Ni, Tianming ; Yao, Yao ; Chang, Hao ; Lu, Lin ; Liang, Huaguo ; Yan, Aibin ; Huang, Zhengfeng ; Wen, Xiaoqing
IEEE transactions on computer-aided design of integrated circuits and systems, 2020-10, Vol.39 (10), p.2938-2951 [Periódico revisado por pares]New York: IEEE
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