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Thermal conductivity of Al–Cu–Mg–Si alloys: Experimental measurement and CALPHAD modeling

Zhang, Cong ; Du, Yong ; Liu, Shuhong ; Liu, Yuling ; Sundman, Bo

Thermochimica acta, 2016-07, Vol.635, p.8-16 [Periódico revisado por pares]

Elsevier B.V

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  • Título:
    Thermal conductivity of Al–Cu–Mg–Si alloys: Experimental measurement and CALPHAD modeling
  • Autor: Zhang, Cong ; Du, Yong ; Liu, Shuhong ; Liu, Yuling ; Sundman, Bo
  • Assuntos: Alloys ; Al–Cu–Mg–Si alloys ; CALPHAD ; Computer simulation ; Heat transfer ; Laser-flash method ; Mathematical models ; Modelling ; Phase transformations ; Scanning electron microscopy ; Thermal conductivity
  • É parte de: Thermochimica acta, 2016-07, Vol.635, p.8-16
  • Notas: ObjectType-Article-1
    SourceType-Scholarly Journals-1
    ObjectType-Feature-2
    content type line 23
  • Descrição: •The thermal conductivities of Al–xwt% Cu (x=1, 3, 5, 15 and 30) and Al–ywt% Si (y=2, 12.5 and 20) alloys were determined.•The reported thermal conductivities of Al–Cu–Mg–Si system were critically reviewed.•The CALPHAD approach was applied for the modeling of thermal conductivity.•The applicability of CALPHAD technique in the modeling of thermal conductivity was discussed. In the present work, the thermal conductivities and microstructure of Al–xwt% Cu (x=1, 3, 5, 15 and 30) and Al–ywt% Si (y=2, 12.5 and 20) alloys were investigated by using laser-flash method, scanning electron microscopy (SEM) and X-ray diffraction (XRD). Besides, a CALPHAD (CALculation of PHAse Diagram) approach to evaluate the thermal conductivity of Al–Cu–Mg–Si system was performed. The numerical models for the thermal conductivity of pure elements and stoichiometric phases were described as polynomials, and the coefficients were optimized via PARROT module of Thermal-Calc software applied to the experimental data. The thermal conductivity of (Al)-based solid solutions was described by using Redlich–Kister interaction parameters. For alloys in two-phase region, the interface scattering parameter was proposed in the modeling to describe the impediment of interfaces on the heat transfer. Finally, a set of self-consistent parameters for the description of thermal conductivity in Al–Cu–Mg–Si system was obtained, and comprehensive comparisons between the calculated and measured thermal conductivities show that the experimental information is satisfactorily accounted for by the present modeling.
  • Editor: Elsevier B.V
  • Idioma: Inglês;Holandês
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  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

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