Characterization of intermetallic compounds in Cu–Al ball bonds: Mechanical properties, interface delamination and thermal conductivity

Kouters, M.H.M. ; Gubbels, G.H.M. ; Dos Santos Ferreira, O.

Microelectronics and reliability, 2013-08, Vol.53 (8), p.1068-1075 [Periódico revisado por pares]

Elsevier Ltd

Texto completo disponível