High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers

Hong, Jung-Pyo ; Yoon, Sung-Woon ; Hwang, Taeseon ; Oh, Joon-Suk ; Hong, Seung-Chul ; Lee, Youngkwan ; Nam, Jae-Do

Thermochimica acta, 2012-06, Vol.537, p.70-75 [Periódico revisado por pares]

Oxford: Elsevier B.V

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