Sub-20 nm Si fins with high aspect ratio via pattern transfer using fullerene-based spin-on-carbon hard masks

Tseng, Li-Ting ; Kazazis, Dimitrios ; Wang, Xiaolong ; Popescu, Carmen M. ; Robinson, Alex P.G. ; Ekinci, Yasin

Microelectronic engineering, 2019-04, Vol.210, p.8-13 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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