Idioma:

Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging

Basaran, Cemal ; Gomez, Juan ; Lin, Minghui ; Li, Shidong

Proceedings of the 2007 Summer Computer Simulation Conference, 2007, p.269-275

San Diego, CA, USA: Society for Computer Simulation International

Texto completo disponível

Citações Citado por

Enviar para

Título:
Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging
Autor: Basaran, Cemal ; Gomez, Juan ; Lin, Minghui ; Li, Shidong
Assuntos: Applied computing ; Applied computing -- Enterprise computing ; Applied computing -- Physical sciences and engineering ; Applied computing -- Physical sciences and engineering -- Engineering ; Applied computing -- Physical sciences and engineering -- Physics ; Computing methodologies ; Computing methodologies -- Modeling and simulation ; Computing methodologies -- Modeling and simulation -- Model development and analysis ; Mathematics of computing ; Mathematics of computing -- Mathematical analysis ; Mathematics of computing -- Mathematical analysis -- Numerical analysis ; Mathematics of computing -- Mathematical analysis -- Numerical analysis -- Computations in finite fields ; Mathematics of computing -- Mathematical analysis -- Numerical analysis -- Numerical differentiation ; Software and its engineering ; Software and its engineering -- Software notations and tools
É parte de: Proceedings of the 2007 Summer Computer Simulation Conference, 2007, p.269-275
Descrição: The problem of concurrent thermal and vibration loading has not been thoroughly studied even though it is common in electronic packaging applications. Here we attempt to address such a problem using a damage mechanics based constitutive model. Damage mechanics constitutive model for eutectic Pb/Sn solder alloys is used to simulate the damage effects of concurrent cyclic thermal loads and vibrations on electronics packages. The model is implemented into the commercial finite element code ABAQUS through its user defined material subroutine capability. For the integration algorithm we have used a return mapping scheme, which dramatically improves the convergence rate as compared to previous implementations of the same model. Results are examined in terms of accumulation of plastic strain within the solder connections. It is shown that the simplistic Miner's rule can not accurately account for the combined effect of both loadings acting concurrently.
Editor: San Diego, CA, USA: Society for Computer Simulation International
Idioma: Inglês

Voltar para lista de resultados

Realização: Logos de Redes Sociais:

Damage mechanics modeling of concurrent thermal and vibration loading on electronics packaging

Basaran, Cemal ; Gomez, Juan ; Lin, Minghui ; Li, Shidong

San Diego, CA, USA: Society for Computer Simulation International

Buscando em bases de dados remotas. Favor aguardar.