Damage mechanics of microelectronics solder joints under high current densities

Hua Ye ; Basaran, C. ; Hopkins, D.C. ; Frear, D. ; Jong-Kai Lin

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.1, p.988-997 Vol.1

Piscataway NJ: IEEE

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