Microstructure evolution and mechanical reliability of Cu/Au–Sn/Cu joints during transient liquid phase bonding

Peng, J. ; Liu, H. S. ; Ma, H. B. ; Shi, X. M. ; Wang, R. C.

Journal of materials science, 2018-06, Vol.53 (12), p.9287-9296 [Periódico revisado por pares]

New York: Springer US

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