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Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints

Wang, Haozhong ; Hu, Xiaowu ; Jiang, Xiongxin

Materials characterization, 2020-05, Vol.163, p.110287, Article 110287 [Periódico revisado por pares]

Elsevier Inc

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  • Título:
    Effects of Ni modified MWCNTs on the microstructural evolution and shear strength of Sn-3.0Ag-0.5Cu composite solder joints
  • Autor: Wang, Haozhong ; Hu, Xiaowu ; Jiang, Xiongxin
  • Assuntos: Interfacial reaction ; Intermetallic compounds (IMCs) ; Lead-free solder ; Mechanical strength ; Multi-walled carbon nanotubes (MWCNTs) ; Shear text
  • É parte de: Materials characterization, 2020-05, Vol.163, p.110287, Article 110287
  • Descrição: A composite solder was prepared by adding different amount Ni modified multi-walled carbon nanotubes (MWCNTs) into the Sn-3.0Ag-0.5Cu (SAC305) solder. Experiments were conducted to investigate the thermal behavior, mechanical properties of composite solder alloys, shear fracture behavior of solder joints were evaluated as well. The modification process was carried out on the MWCNTs using electroless modification method to synthesis the Ni modified carbon nanotubes (Ni-CNTs), which was manually mixed into SAC305 solder powder with different amount. The melting point of the composite solder alloys was slightly increased with the increment of the amount of Ni-CNTs. The nanoindentation test results confirmed that the hardness and modulus of composite solder alloys were enhanced after the addition of Ni-CNTs. The aging experiment was implemented for the joints and the results indicated that the Ni-CNTs could effectively inhibit the growth of IMC layer as an additive in SAC305 solder. The shear strength of SAC305-xNi-CNTs/Cu (x = 0, 0.1 and 0.2 wt.%) joints was reinforced with the increment of Ni-CNTs amount. Furthermore, the SAC305-0Ni-CNTs/Cu and SAC305-0.1Ni-CNTs/Cu solder joints were broken partially between the solder and IMC, mostly between the solder matrix, and SAC305-0.2Ni-CNTs/Cu solder joint was broken completely inside solder matrix. It was suggested that the fracture mode of the solder joints changed from mix fracture mode to ductile fracture mode as the amount of Ni-CNTs increased. •Ni modified carbon nanotubes (Ni-CNTs) was synthesized using electroless modification method.•The hardness and modulus of composite solder alloys were enhanced after the addition of Ni-CNTs.•Ni-CNTs could effectively inhibit the growth of IMC layer as an additive in SAC305 solder.•The shear strength of composite solder joints was reinforced with the increment of Ni-CNTs amount.
  • Editor: Elsevier Inc
  • Idioma: Inglês
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  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

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