Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications

Kant Bajpai, Vishnu ; Kumar Mishra, Dileep ; Dixit, Pradeep

Applied surface science, 2022-05, Vol.584, p.152494, Article 152494 [Periódico revisado por pares]

Elsevier B.V

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