Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis
Oliveira, Bruno M C ; Santos, Ruben F ; Piedade, Ana P ; Ferreira, Paulo J ; Vieira, Manuel F
Nanomaterials (Basel, Switzerland), 2022-05, Vol.12 (10), p.1752 [Periódico revisado por pares]Switzerland: MDPI AG
Texto completo disponível