Evaluation of Strain Measurement in a Die-to-Interposer Chip Using In Situ Synchrotron X-ray Diffraction and Finite-Element Analysis : LEAD-FREE SOLDERS

HSU, Hsueh-Hsien ; CHIU, Tz-Cheng ; HUANG, Yi-Ting ; WU, Albert T ; CHANG, Tao-Chih ; HUANG, Shin-Yi ; LEE, Hsin-Yi ; KU, Ching-Shun ; LIN, Yang-Yi ; SU, Chien-Hao ; CHOU, Li-Wei ; OUYANG, Yao-Tsung

Journal of electronic materials, 2014, Vol.43 (1), p.52-56 [Periódico revisado por pares]

Heidelberg: Springer

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