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A review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization

Seo, Jihoon

Journal of materials research, 2021-01, Vol.36 (1), p.235-257 [Periódico revisado por pares]

Cham: Springer International Publishing

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  • Título:
    A review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization
  • Autor: Seo, Jihoon
  • Assuntos: Applied and Technical Physics ; Biomaterials ; Chemical reactions ; Chemical-mechanical polishing ; Chemistry and Materials Science ; Inorganic Chemistry ; Integrated circuits ; Materials Engineering ; Materials research ; Materials Science ; Nanotechnology ; Review ; Slurries ; Temperature effects
  • É parte de: Journal of materials research, 2021-01, Vol.36 (1), p.235-257
  • Descrição: As the minimum feature size of integrated circuit elements has shrunk below 7 nm, chemical mechanical planarization (CMP) technology has grown by leaps and bounds over the past several decades. There has been a growing interest in understanding the fundamental science and technology of CMP, which has continued to lag behind advances in technology. This review paper provides a comprehensive overview of various chemical and mechanical phenomena such as contact mechanics, lubrication models, chemical reaction that occur between slurry components and films being polished, electrochemical reactions, adsorption behavior and mechanism, temperature effects, and the complex interactions occurring at the wafer interface during polishing. It also provides important insights into new strategies and novel concepts for next‐generation CMP slurries. Finally, the challenges and future research directions related to the chemical and mechanical process and slurry chemistry are highlighted.
  • Editor: Cham: Springer International Publishing
  • Idioma: Inglês
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  • Realização: ABCD-USP USP   Logos de Redes Sociais: Freepik

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