High-cycle fatigue strength and small-crack growth behavior of ultrafine-grained copper with post-ECAP annealing

Goto, M. ; Teshima, N. ; Han, S.Z. ; Euh, K. ; Yakushiji, T. ; Kim, S.S. ; Lee, J.

Engineering fracture mechanics, 2013-09, Vol.110, p.218-232 [Periódico revisado por pares]

Elsevier Ltd

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