Idioma:

Three-dimensional integration of nanotechnologies for computing and data storage on a single chip

Shulaker, Max M ; Hills, Gage ; Park, Rebecca S ; Howe, Roger T ; Saraswat, Krishna ; Wong, H-S Philip ; Mitra, Subhasish

Nature (London), 2017-07, Vol.547 (7661), p.74-78 [Periódico revisado por pares]

England: Nature Publishing Group

Texto completo disponível

Citações Citado por

Enviar para

Título:
Three-dimensional integration of nanotechnologies for computing and data storage on a single chip
Autor: Shulaker, Max M ; Hills, Gage ; Park, Rebecca S ; Howe, Roger T ; Saraswat, Krishna ; Wong, H-S Philip ; Mitra, Subhasish
Assuntos: Carbon ; Computer architecture ; Computer memory ; Data processing ; Data storage ; Electronic systems ; Energy ; Energy consumption ; Energy efficiency ; Energy storage ; Engineering research ; Fabrication ; Field effect transistors ; Gases ; Information processing ; Information storage and retrieval ; Innovations ; Integrated circuits ; Logic circuits ; Memory cells ; Nanostructure ; Nanotechnology ; Semiconductor devices ; Semiconductors ; Silicon ; Transistors
É parte de: Nature (London), 2017-07, Vol.547 (7661), p.74-78
Notas: ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
Descrição: The computing demands of future data-intensive applications will greatly exceed the capabilities of current electronics, and are unlikely to be met by isolated improvements in transistors, data storage technologies or integrated circuit architectures alone. Instead, transformative nanosystems, which use new nanotechnologies to simultaneously realize improved devices and new integrated circuit architectures, are required. Here we present a prototype of such a transformative nanosystem. It consists of more than one million resistive random-access memory cells and more than two million carbon-nanotube field-effect transistors-promising new nanotechnologies for use in energy-efficient digital logic circuits and for dense data storage-fabricated on vertically stacked layers in a single chip. Unlike conventional integrated circuit architectures, the layered fabrication realizes a three-dimensional integrated circuit architecture with fine-grained and dense vertical connectivity between layers of computing, data storage, and input and output (in this instance, sensing). As a result, our nanosystem can capture massive amounts of data every second, store it directly on-chip, perform in situ processing of the captured data, and produce 'highly processed' information. As a working prototype, our nanosystem senses and classifies ambient gases. Furthermore, because the layers are fabricated on top of silicon logic circuitry, our nanosystem is compatible with existing infrastructure for silicon-based technologies. Such complex nano-electronic systems will be essential for future high-performance and highly energy-efficient electronic systems.
Editor: England: Nature Publishing Group
Idioma: Inglês

Links

View this record in MEDLINE/PubMed

Voltar para lista de resultados

Realização: Logos de Redes Sociais:

Three-dimensional integration of nanotechnologies for computing and data storage on a single chip

Shulaker, Max M ; Hills, Gage ; Park, Rebecca S ; Howe, Roger T ; Saraswat, Krishna ; Wong, H-S Philip ; Mitra, Subhasish

England: Nature Publishing Group

Buscando em bases de dados remotas. Favor aguardar.