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Modulation Transfer Noise Effects from a Continuous Digital Carrier to FDM/FM Carriers in Memoryless Nonlinear Devices

Albuquerque, J.P. ; Shimbo, O. ; Nguyen, L.

IEEE transactions on communications, 1984-01, Vol.32 (4), p.337-345 [Periódico revisado por pares]

New York, NY: IEEE

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Título:
Modulation Transfer Noise Effects from a Continuous Digital Carrier to FDM/FM Carriers in Memoryless Nonlinear Devices
Autor: Albuquerque, J.P. ; Shimbo, O. ; Nguyen, L.
Assuntos: Applied sciences ; Baseband ; Circuit properties ; Digital filters ; Digital modulation ; Electric, optical and optoelectronic circuits ; Electronics ; Exact sciences and technology ; Filtering ; Miscellaneous ; Phase shift keying ; Pulse amplifiers ; Pulse modulation ; Satellites ; Signal to noise ratio ; Transponders
É parte de: IEEE transactions on communications, 1984-01, Vol.32 (4), p.337-345
Notas: ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
Descrição: An analysis of the modulation transfer noise effects from a continuous (nonbursty) digital carrier to multiple FDM/FM carriers in a common memoryless nonlinear amplifier (e.g., satellite transponder TWTA) is presented. It is shown that the modulation transfer noise, which is caused by the random envelope variations of the digital carrier due to the random data patterns and filtering of the PSK pulses, consists of both discrete and continuous spectral components in the baseband of the FDM/FM carriers. Numerical examples in terms of the noise power ratio as well as a comparison between measured and computed results are given. In general, the discrete or tonal interference component at the symbol rate of the digital carrier is quite significant. Results of this paper should be useful in the planning of FDMA satellite transponders employing the mixed PSK-FM mode of operation.
Editor: New York, NY: IEEE
Idioma: Inglês

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Modulation Transfer Noise Effects from a Continuous Digital Carrier to FDM/FM Carriers in Memoryless Nonlinear Devices

Albuquerque, J.P. ; Shimbo, O. ; Nguyen, L.

New York, NY: IEEE

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