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Reactive wetting of copper and copper alloy plates by liquid tin and liquid 60% (wt.)Sn-40%Pb(wt.)

Katia Marques Martorano Sérgio Duarte Brandi 1956-; International Technical Symposium on Packaging and Assembling (2001 São Paulo)

Proceedings São Paulo : IMAPS BRASIL, 2001

São Paulo IMAPS BRASIL 2001

Item não circula. Consulte sua biblioteca.(Acessar)

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