Reactive wetting of copper and copper alloy plates by liquid tin and liquid 60% (wt.)Sn-40%Pb(wt.)
Katia Marques Martorano Sérgio Duarte Brandi 1956-; International Technical Symposium on Packaging and Assembling (2001 São Paulo)
Proceedings São Paulo : IMAPS BRASIL, 2001São Paulo IMAPS BRASIL 2001
Item não circula. Consulte sua biblioteca.(Acessar)