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| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
Material Type: Artículo
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3-D Mesh-Based Optical Network-on-Chip for Multiprocessor System-on-ChipYaoyao Ye ; Jiang Xu ; Baihan Huang ; Xiaowen Wu ; Wei Zhang ; Xuan Wang ; Nikdast, M. ; Zhehui Wang ; Weichen Liu ; Zhe WangIEEE transactions on computer-aided design of integrated circuits and systems, 2013-04, Vol.32 (4), p.584-596 [Revista revisada por pares]IEEETexto completo disponible |
| 2 |
Material Type: Artículo
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3-D Thermal-ADI: a linear-time chip level transient thermal simulatorWang, Ting-Yuan ; Chen, Charlie Chung-PingIEEE transactions on computer-aided design of integrated circuits and systems, 2002-12, Vol.21 (12), p.1434-1445 [Revista revisada por pares]New York: IEEETexto completo disponible |
| 3 |
Material Type: Artículo
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3-valued trace-based fault simulation of synchronous sequential circuitsSong, O.Y. ; Menon, P.R.IEEE transactions on computer-aided design of integrated circuits and systems, 1993-09, Vol.12 (9), p.1419-1424 [Revista revisada por pares]New York, NY: IEEETexto completo disponible |
| 4 |
Material Type: Artículo
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A 2-D boundary element method approach to the simulation of DMOS transistorsZhou, M.-J. ; De Smet, H. ; De Bruycker, A. ; Van Calster, A.IEEE transactions on computer-aided design of integrated circuits and systems, 1993-06, Vol.12 (6), p.810-816 [Revista revisada por pares]New York, NY: IEEETexto completo disponible |
| 5 |
Material Type: Artículo
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A 3-D Split Manufacturing Approach to Trustworthy System DevelopmentValamehr, J. ; Sherwood, T. ; Kastner, R. ; Marangoni-Simonsen, D. ; Huffmire, T. ; Irvine, C. ; Levin, T.IEEE transactions on computer-aided design of integrated circuits and systems, 2013-04, Vol.32 (4), p.611-615 [Revista revisada por pares]IEEETexto completo disponible |
| 6 |
Material Type: Artículo
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ABCFI: Fast and Lightweight Fine-Grained Hardware-Assisted Control-Flow IntegrityLi, Jinfeng ; Chen, Liwei ; Shi, Gang ; Chen, Kai ; Meng, DanIEEE transactions on computer-aided design of integrated circuits and systems, 2020-11, Vol.39 (11), p.3165-3176 [Revista revisada por pares]New York: IEEETexto completo disponible |
| 7 |
Material Type: Artículo
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Accelerated Chip-Level Thermal Analysis Using Multilayer Green's FunctionBaohua Wang ; Mazumder, P.IEEE transactions on computer-aided design of integrated circuits and systems, 2007-02, Vol.26 (2), p.325-344 [Revista revisada por pares]New York: IEEETexto completo disponible |
| 8 |
Material Type: Artículo
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Accelerated waveform methods for parallel transient simulation of semiconductor devicesLumsdaine, A. ; Reichelt, M.W. ; Squyres, J.M. ; White, J.K.IEEE transactions on computer-aided design of integrated circuits and systems, 1996-07, Vol.15 (7), p.716-726 [Revista revisada por pares]New York, NY: IEEETexto completo disponible |
| 9 |
Material Type: Artículo
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Accelerating Electromigration Aging: Fast Failure Detection for Nanometer ICsSadiqbatcha, Sheriff ; Sun, Zeyu ; Tan, Sheldon X.-D.IEEE transactions on computer-aided design of integrated circuits and systems, 2020-04, Vol.39 (4), p.885-894 [Revista revisada por pares]New York: IEEETexto completo disponible |
| 10 |
Material Type: Artículo
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Accelerating Queries of Big Data Systems by Storage-Side CPU-FPGA Co-DesignZhan, Jinyu ; Jiang, Wei ; Li, Ying ; Wu, Junting ; Zhu, Jianping ; Yu, JinghuanIEEE transactions on computer-aided design of integrated circuits and systems, 2022-07, Vol.41 (7), p.2128-2141 [Revista revisada por pares]IEEETexto completo disponible |
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