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0–360 Degrees angular measurements using spatial displacement
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Artículo
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0–360 Degrees angular measurements using spatial displacement

Yuan, Yangsheng ; Xu, Didi ; Cheng, Ruishan ; Gao, Yaru ; Hoenders, Bernhard J. ; Cai, Yangjian

Applied physics letters, 2023-03, Vol.122 (11) [Revista revisada por pares]

Melville: American Institute of Physics

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(001) FePt graded media with PtMn underlayers
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(001) FePt graded media with PtMn underlayers

Chiang, Chao-Chien ; Tsai, Wu-Chang ; Wang, Liang-Wei ; Hou, Hao-Cheng ; Liao, Jung-Wei ; Lin, Hong-Ji ; Chang, Fan-Hsiu ; Kirby, Brian J. ; Lai, Chih-Huang

Applied physics letters, 2011-11, Vol.99 (21), p.212504-212504-3 [Revista revisada por pares]

American Institute of Physics

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3
0.14THz high speed data communication over 1.5 kilometers
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Acta de Congreso
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0.14THz high speed data communication over 1.5 kilometers

Cheng Wang ; Changxing Lin ; Qi Chen ; Xianjin Deng ; Jian Zhang

2012 37th International Conference on Infrared, Millimeter, and Terahertz Waves, 2012, p.1-2

IEEE

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4
0.2-μm gate-length InGaP-InGaAs DCFETs for c-band MMIC amplifier applications
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Artículo
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0.2-μm gate-length InGaP-InGaAs DCFETs for c-band MMIC amplifier applications

Chiu, Hsien-Chin ; Yang, Shih-Cheng ; Lin, Cheng-Kuo ; Hwu, Ming-Jyh ; Chan, Yi-Jen

IEEE transactions on electron devices, 2003-07, Vol.50 (7), p.1599-1603 [Revista revisada por pares]

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5
0.25- mu m pseudomorphic HEMTs processed with damage-free dry-etch gate-recess technology
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Artículo
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0.25- mu m pseudomorphic HEMTs processed with damage-free dry-etch gate-recess technology

Ren, F. ; Pearton, S.J. ; Abernathy, C.R. ; Wu, C.S. ; Hu, M. ; Pao, C.-K. ; Wang, D.C. ; Wen, C.P.

IEEE transactions on electron devices, 1992-12, Vol.39 (12), p.2701-2706 [Revista revisada por pares]

NEW YORK: IEEE

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6
0.34-THz Wireless Link Based on High-Order Modulation for Future Wireless Local Area Network Applications
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0.34-THz Wireless Link Based on High-Order Modulation for Future Wireless Local Area Network Applications

Wang, Cheng ; Lu, Bin ; Lin, Changxing ; Chen, Qi ; Miao, Li ; Deng, Xianjin ; Zhang, Jian

IEEE transactions on terahertz science and technology, 2014-01, Vol.4 (1), p.75-85 [Revista revisada por pares]

Piscataway: IEEE

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7
0D/2D NiS/CdS nanocomposite heterojunction photocatalyst with enhanced photocatalytic H2 evolution activity
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Artículo
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0D/2D NiS/CdS nanocomposite heterojunction photocatalyst with enhanced photocatalytic H2 evolution activity

Liu, Xiangyu ; Bie, Chuanbiao ; He, Bowen ; Zhu, Bicheng ; Zhang, Liuyang ; Cheng, Bei

Applied surface science, 2021-07, Vol.554, p.149622, Article 149622 [Revista revisada por pares]

Elsevier B.V

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8
0D Hybrid Cuprous Halide as an Efficient Light Emitter and X‐Ray Scintillator
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0D Hybrid Cuprous Halide as an Efficient Light Emitter and X‐Ray Scintillator

Lin, Na ; Wang, Ri‐Cheng ; Zhang, Shao‐Ya ; Lin, Zi‐Han ; Chen, Xing‐Yu ; Li, Zi‐Ning ; Lei, Xiao‐Wu ; Wang, Yu‐Yin ; Yue, Cheng‐Yang

Laser & photonics reviews, 2023-12, Vol.17 (12), p.n/a [Revista revisada por pares]

Weinheim: Wiley Subscription Services, Inc

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9
1-100GHz microwave photonics link technologies for next-generation WiFi and 5G wireless communications
Material Type:
Acta de Congreso
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1-100GHz microwave photonics link technologies for next-generation WiFi and 5G wireless communications

Gee-Kung Chang ; Cheng Liu

2013 IEEE International Topical Meeting on Microwave Photonics (MWP), 2013, p.5-8

IEEE

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10
1,1-Dimethylhydrazine as a high purity nitrogen source for MOVPE-water reduction and quantification using nuclear magnetic resonance, gas chromatography-atomic emission detection spectroscopy and cryogenic-mass spectroscopy analytical techniques
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1,1-Dimethylhydrazine as a high purity nitrogen source for MOVPE-water reduction and quantification using nuclear magnetic resonance, gas chromatography-atomic emission detection spectroscopy and cryogenic-mass spectroscopy analytical techniques

Odedra, R. ; Smith, L. M. ; Rushworth, S. A. ; Ravetz, M. S. ; Clegg, J. ; Kanjolia, R. ; Irvine, S. J. C. ; Ahmed, M. U. ; Bourret-Courchesne, E. D. ; Li, N. Y. ; Cheng, J.

Journal of electronic materials, 2000-01, Vol.29 (1), p.161-164 [Revista revisada por pares]

United States

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