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1
0.0354mm 82μW 125KS/s 3-axis readout circuit for capacitive MEMS accelerometer
Material Type:
Conference Proceeding
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0.0354mm 82μW 125KS/s 3-axis readout circuit for capacitive MEMS accelerometer

Lai, Kelvin Yi-Tse ; Zih-Cheng He ; Yu-Tao Yang ; Hsie-Chia Chang ; Chen-Yi Lee

2013 IEEE Asian Solid-State Circuits Conference (A-SSCC), 2013, p.109-112

IEEE

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2
A 0.001-mm2 112.32-μW All-Digital PLL with Dual-Tuned DCO and Dual-Tuned Control Algorithm
Material Type:
Article
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A 0.001-mm2 112.32-μW All-Digital PLL with Dual-Tuned DCO and Dual-Tuned Control Algorithm

Zhang, Peiyong ; Su, Yuquan ; Yang, Yiwei

Circuits, systems, and signal processing, 2022-03, Vol.41 (3), p.1563-1576 [Peer Reviewed Journal]

New York: Springer US

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3
A 0.0012 mm[sup.2] 6-bit 700 MS/s 1 mW Calibration-Free Pseudo-Loop-Unrolled SAR ADC in 28 nm CMOS
Material Type:
Article
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A 0.0012 mm[sup.2] 6-bit 700 MS/s 1 mW Calibration-Free Pseudo-Loop-Unrolled SAR ADC in 28 nm CMOS

An, Eun-Ji ; Oh, Dong-Ryeol

Electronics (Basel), 2022-06, Vol.11 (11) [Peer Reviewed Journal]

MDPI AG

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4
A 0.0018 mm frequency-to-digital-converter-based CMOS smart temperature sensor
Material Type:
Article
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A 0.0018 mm frequency-to-digital-converter-based CMOS smart temperature sensor

Lee, Hokyu ; Kim, Kisoo ; Jung, Sangdon ; Song, Janghoon ; Kim, Jong-Kook ; Kim, Chulwoo

Analog integrated circuits and signal processing, 2010-08, Vol.64 (2), p.153-157 [Peer Reviewed Journal]

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5
A 0.0023 mm[Formula Omitted]/ch. Delta-Encoded, Time-Division Multiplexed Mixed-Signal ECoG Recording Architecture With Stimulus Artifact Suppression
Material Type:
Article
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A 0.0023 mm[Formula Omitted]/ch. Delta-Encoded, Time-Division Multiplexed Mixed-Signal ECoG Recording Architecture With Stimulus Artifact Suppression

Uehlin, John P ; Smith, William Anthony ; V Rajesh Pamula ; Perlmutter, Steve I ; Rudell, Jacques C ; Sathe, Visvesh S

IEEE transactions on biomedical circuits and systems, 2020-04, Vol.14 (2), p.319 [Peer Reviewed Journal]

New York: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)

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6
A 0.004-mm ^ Portable Multiphase Clock Generator Tile for 1.2-GHz RISC Microprocessor
Material Type:
Article
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A 0.004-mm ^ Portable Multiphase Clock Generator Tile for 1.2-GHz RISC Microprocessor

Jung, Inhwa ; Jung, Gunok ; Song, Janghoon ; Kim, Moo-Young ; Park, Junyoung ; Park, Sung Bae ; Kim, Chulwoo

IEEE transactions on circuits and systems. II, Express briefs, 2008-02, Vol.55 (2), p.116-120 [Peer Reviewed Journal]

IEEE

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7
A 0.004-mm2 200-MS/s Pipelined SAR ADC With kT/C Noise Cancellation and Robust Ring-Amp
Material Type:
Article
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A 0.004-mm2 200-MS/s Pipelined SAR ADC With kT/C Noise Cancellation and Robust Ring-Amp

Zhan, Mingtao ; Jie, Lu ; Tang, Xiyuan ; Zhong, Yi ; Sun, Nan

IEEE journal of solid-state circuits, 2024-07, Vol.59 (7), p.2209-2218 [Peer Reviewed Journal]

IEEE

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8
A 0.004% resolution & SAT<1.8 μson-chip adaptive anti-aging system using cuckoo intelligence-based algorithm in 65 nm CMOS
Material Type:
Article
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A 0.004% resolution & SAT<1.8 μson-chip adaptive anti-aging system using cuckoo intelligence-based algorithm in 65 nm CMOS

Zhang, Yuejun ; Zhang, Haiming ; Wang, Pengjun ; Wu, Qiufeng ; Li, Gang

Integration (Amsterdam), 2021-05, Vol.78, p.135-143 [Peer Reviewed Journal]

Amsterdam: Elsevier B.V

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9
A 0.00426 mm[sup.2] 77.6-dB Dynamic Range VCO-Based CTDSM for Multi-Channel Neural Recording
Material Type:
Article
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A 0.00426 mm[sup.2] 77.6-dB Dynamic Range VCO-Based CTDSM for Multi-Channel Neural Recording

Wang, Shiwei ; Yang, Xiaolin ; Wang, Chaohan ; Vilouras, Anastasios ; Lopez, Carolina Mora

Electronics (Basel), 2022-11, Vol.11 (21) [Peer Reviewed Journal]

MDPI AG

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10
A 0.0043-mm2 0.085-&#956;W/MHz Relaxation Oscillator Using Charge-Prestored Asymmetric Swings R-RC Network
Material Type:
Article
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A 0.0043-mm2 0.085-μW/MHz Relaxation Oscillator Using Charge-Prestored Asymmetric Swings R-RC Network

Wei, Yuchen ; Yang, Shiheng ; Liu, Yueduo ; Bao, Rongxin ; Zhu, Zihao ; Lin, Jiahui ; Zhang, Zehao ; Chen, Yong ; Yin, Jun ; Mak, Pui-In ; Li, Qiang

IEEE transactions on very large scale integration (VLSI) systems, 2023-08, Vol.31 (8), p.1248-1252 [Peer Reviewed Journal]

New York: IEEE

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