Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Tese de Doutorado
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Formação e reatividade de filmes finos de macrocíclicos de ferro sobre silício monocristalinoAndresa, Juliana SalvadorBiblioteca Digital de Teses e Dissertações da USP; Universidade de São Paulo; Instituto de Química de São Carlos 2007-10-31Acesso online. A biblioteca também possui exemplares impressos. |
2 |
Material Type: Artigo
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Revisiting thin silicon for photovoltaics: a technoeconomic perspectiveLiu, Zhe ; Sofia, Sarah E ; Laine, Hannu S ; Woodhouse, Michael ; Wieghold, Sarah ; Peters, Ian Marius ; Buonassisi, TonioEnergy & environmental science, 2020-01, Vol.13 (1), p.12-23 [Periódico revisado por pares]Cambridge: Royal Society of ChemistryTexto completo disponível |
3 |
Material Type: Artigo
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Detection of sub-500-μm cracks in multicrystalline silicon wafer using edge-illuminated dark-field imaging to enable thin solar cell manufacturingWieghold, Sarah ; Liu, Zhe ; Raymond, Samuel J. ; Meyer, Luke T. ; Williams, John R. ; Buonassisi, Tonio ; Sachs, Emanuel M.Solar energy materials and solar cells, 2019-07, Vol.196 (C), p.70-77 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
4 |
Material Type: Artigo
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Polycrystalline silicon wafer defect segmentation based on deep convolutional neural networksHan, Hui ; Gao, Chenqiang ; Zhao, Yue ; Liao, Shisha ; Tang, Lin ; Li, XindouPattern recognition letters, 2020-02, Vol.130, p.234-241 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
5 |
Material Type: Artigo
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Evaluation of fixed abrasive diamond wire sawing induced subsurface damage of solar silicon wafersXiao, Huapan ; Wang, Hairong ; Yu, Na ; Liang, Rongguang ; Tong, Zhe ; Chen, Zhi ; Wang, JiuhongJournal of materials processing technology, 2019-11, Vol.273, p.116267, Article 116267 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
6 |
Material Type: Artigo
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Two-dimensional detection of subsurface damage in silicon wafers with polarized laser scatteringYin, Jingfei ; Bai, Qian ; Haitjema, Han ; Zhang, BiJournal of materials processing technology, 2020-10, Vol.284, p.116746, Article 116746 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
7 |
Material Type: Artigo
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The influence of surface treatment on the performance of photoconductive detectors based on silicon wafer (April 2024)Wu, Leyao ; Zhang, Miao ; Shi, Xinnan ; Hu, Peng ; Yu, Haiping ; Teng, FengIEEE sensors journal, 2024, Vol.24 (13), p.1-1 [Periódico revisado por pares]New York: IEEETexto completo disponível |
8 |
Material Type: Artigo
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Where I workFonseca, LuisNature (London), 2023-03, Vol.615 (7953), p.758-758 [Periódico revisado por pares]London: Nature Publishing GroupTexto completo disponível |
9 |
Material Type: Artigo
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Undeformed chip width non-uniformity modeling and surface roughness prediction in wafer self-rotational grinding processTao, Hongfei ; Liu, Yuanhang ; Zhao, Dewen ; Lu, XinchunTribology international, 2022-07, Vol.171, p.107547, Article 107547 [Periódico revisado por pares]Kidlington: Elsevier LtdTexto completo disponível |
10 |
Material Type: Artigo
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Effect of Silicon Wafer Surface Stains on Copper-Assisted Chemical EtchingMa, Liang ; Chen, Xiuhua ; Tang, Chenggui ; Li, Shaoyuan ; Xi, Fengshuo ; Lan, Huayan ; Ma, Wenhui ; Chang, YuanchihMetals (Basel ), 2023-04, Vol.13 (4), p.742 [Periódico revisado por pares]Basel: MDPI AGTexto completo disponível |