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Material Type: Artigo
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Single-Cell Isolation Microfluidic Chip Based on Thermal Bubble Micropump TechnologyXu, Chao ; Wang, Kun ; Huang, Peng ; Liu, Demeng ; Guan, YiminSensors (Basel, Switzerland), 2023-03, Vol.23 (7), p.3623 [Periódico revisado por pares]Switzerland: MDPI AGTexto completo disponível |
2 |
Material Type: Artigo
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A Smart Active Phase-Change Micropump Based on CMOS-MEMS TechnologyJin, Wenzui ; Guan, Yimin ; Wang, Qiushi ; Huang, Peng ; Zhou, Qin ; Wang, Kun ; Liu, DemengSensors (Basel, Switzerland), 2023-05, Vol.23 (11), p.5207 [Periódico revisado por pares]Switzerland: MDPI AGTexto completo disponível |
3 |
Material Type: Artigo
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Advances in Integration, Wearable Applications, and Artificial Intelligence of Biomedical Microfluidics SystemsMa, Xingfeng ; Guo, Gang ; Wu, Xuanye ; Wu, Qiang ; Liu, Fangfang ; Zhang, Hua ; Shi, Nan ; Guan, YiminMicromachines (Basel), 2023-04, Vol.14 (5), p.972 [Periódico revisado por pares]Switzerland: MDPI AGTexto completo disponível |
4 |
Material Type: Artigo
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A Self-Regulated Microfluidic Device with Thermal Bubble MicropumpsGuo, Gang ; Wu, Xuanye ; Liu, Demeng ; Liao, Lingni ; Zhang, Di ; Zhang, Yi ; Mao, Tianjiao ; He, Yuhan ; Huang, Peng ; Wang, Wei ; Su, Lin ; Wang, Shuhua ; Liu, Qi ; Ma, Xingfeng ; Shi, Nan ; Guan, YiminMicromachines (Basel), 2022-09, Vol.13 (10), p.1620 [Periódico revisado por pares]Basel: MDPI AGTexto completo disponível |
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Material Type: Artigo
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Optimization of 25 µm gold wire lead bonding process parameters based on orthogonal testFeng, Dongdong ; Wang, Wei ; Guan, YiminJournal of physics. Conference series, 2023-06, Vol.2524 (1), p.12032 [Periódico revisado por pares]Bristol: IOP PublishingTexto completo disponível |
6 |
Material Type: Artigo
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A study on cell viability based on thermal inkjet three-dimensional bioprintingWang, Qiushi ; Liao, Yuanhong ; Ho, Yuhan ; Wang, Kun ; Jin, Wenzui ; Guan, Yimin ; Fu, WeixinPhysics of fluids (1994), 2023-08, Vol.35 (8) [Periódico revisado por pares]Melville: American Institute of PhysicsTexto completo disponível |
7 |
Material Type: Artigo
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Thermal bubble-driven impedance-based high-throughput cell counting chip designYang, Xiaopeng ; Wang, Kun ; Huang, Peng ; Guan, Yimin ; Liu, DemengAIP advances, 2023-06, Vol.13 (6) [Periódico revisado por pares]Melville: American Institute of PhysicsTexto completo disponível |
8 |
Material Type: Artigo
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A multichannel thermal bubble-actuated impedance flow cytometer with on-chip TIA based on CMOS-MEMSCai, Shengxun ; Nie, Jianqing ; Wang, Kun ; Guan, Yimin ; Liu, DemengJournal of semiconductors, 2024-05, Vol.45 (5), p.52201 [Periódico revisado por pares]Texto completo disponível |
9 |
Material Type: Artigo
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Crystallization Behavior and Luminescence of Inkjet Printing CH3NH3PbBr3Sun, Rui ; Li, Haixia ; Guan, Yimin ; Du, Yong ; Shen, Hui ; Xu, JiayueCrystal research and technology (1979), 2021-08, Vol.56 (8), p.n/a [Periódico revisado por pares]Texto completo disponível |
10 |
Material Type: Artigo
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Crystallization Behavior and Luminescence of Inkjet Printing CH 3 NH 3 PbBr 3Sun, Rui ; Li, Haixia ; Guan, Yimin ; Du, Yong ; Shen, Hui ; Xu, JiayueCrystal research and technology (1979), 2021-08, Vol.56 (8) [Periódico revisado por pares]Texto completo disponível |