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Observational evidence for pollution‐influenced selective uptake contributing to biogenic secondary organic aerosols in the southeastern U.S
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Observational evidence for pollution‐influenced selective uptake contributing to biogenic secondary organic aerosols in the southeastern U.S

Liu, J. ; Russell, L. M. ; Lee, A. K. Y. ; McKinney, K. A. ; Surratt, J. D. ; Ziemann, P. J.

Geophysical research letters, 2017-08, Vol.44 (15), p.8056-8064 [Periódico revisado por pares]

Washington: John Wiley & Sons, Inc

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Analyses on Cleanroom-Free Performance and Transistor Manufacturing Cycle Time of Minimal Fab
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Analyses on Cleanroom-Free Performance and Transistor Manufacturing Cycle Time of Minimal Fab

Khumpuang, Sommawan ; Imura, Fumito ; Hara, Shiro

IEEE transactions on semiconductor manufacturing, 2015-11, Vol.28 (4), p.551-556 [Periódico revisado por pares]

New York: IEEE

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The Influence of Relative Humidity on the Cohesion Properties of Micronized Drugs Used in Inhalation Therapy
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The Influence of Relative Humidity on the Cohesion Properties of Micronized Drugs Used in Inhalation Therapy

Young, Paul M. ; Price, Robert ; Tobyn, Michael J. ; Buttrum, Mark ; Dey, Fiona

Journal of pharmaceutical sciences, 2004-03, Vol.93 (3), p.753-761 [Periódico revisado por pares]

Hoboken: Elsevier Inc

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4
Applications of the Acoustic Method in Partial Discharge Measurement: A Review
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Applications of the Acoustic Method in Partial Discharge Measurement: A Review

Ilkhechi, Hossein Dadashi ; Samimi, Mohammad Hamed

IEEE transactions on dielectrics and electrical insulation, 2021-02, Vol.28 (1), p.42-51 [Periódico revisado por pares]

New York: IEEE

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5
Surface Charging Affecting Metal Particle Lifting Behaviors Around Epoxy Spacer of HVDC GIL/GIS
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Surface Charging Affecting Metal Particle Lifting Behaviors Around Epoxy Spacer of HVDC GIL/GIS

Li, Jin ; Wang, Yuhuai ; Dong, Jianan ; Liang, Hucheng ; Du, Boxue ; Xu, Yongsheng ; Li, Xiaolin

IEEE transactions on dielectrics and electrical insulation, 2022-08, Vol.29 (4), p.1546-1552 [Periódico revisado por pares]

New York: IEEE

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6
Relationships Between Experience, Sleepiness, Height, Reported Task Load, and Performance Scores in Teleoperators for the JET
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Relationships Between Experience, Sleepiness, Height, Reported Task Load, and Performance Scores in Teleoperators for the JET

Piercy, Thomas ; Herrmann, Guido ; Cangelosi, Angelo ; Zoulias, Ioannis Dimitrios ; Pulgarin, Erwin Jose Lopez

IEEE transactions on plasma science, 2024-08, p.1-7 [Periódico revisado por pares]

IEEE

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7
Research and Application of a Novel Sensitivity Measurement Method for Particle Impact Noise Detection Sensors
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Research and Application of a Novel Sensitivity Measurement Method for Particle Impact Noise Detection Sensors

Zhai, Guofu ; Li, Pengfei ; Jin, Jianjia ; Sun, Zhigang ; Wang, Guotao ; Zhao, Xiangjiang

IEEE sensors journal, 2024-03, Vol.24 (6), p.7981-7991 [Periódico revisado por pares]

New York: IEEE

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8
Evaluation of Harmonic Signals Derived From Multiple Spatially Separated Samples for Magnetic Particle Imaging
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Evaluation of Harmonic Signals Derived From Multiple Spatially Separated Samples for Magnetic Particle Imaging

Tanaka, Seiya ; Ota, Satoshi ; Hirano, Harutoyo ; Futagawa, Masato ; Takemura, Yasushi

IEEE transactions on magnetics, 2022-08, Vol.58 (8), p.1-5

New York: IEEE

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9
Microwave Characterization and Assessment of the Dielectric Properties of Normal Human Urine
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Microwave Characterization and Assessment of the Dielectric Properties of Normal Human Urine

Farshkaran, Ali ; Fry, Andrew ; Porter, Emily

IEEE transactions on dielectrics and electrical insulation, 2024-06, Vol.31 (3), p.1143-1150 [Periódico revisado por pares]

New York: IEEE

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10
Two Improved Multiobjective Fractional-Order Particle Swarm Optimization Algorithms for True Temperature Inversion of Multiwavelength Pyrometer
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Two Improved Multiobjective Fractional-Order Particle Swarm Optimization Algorithms for True Temperature Inversion of Multiwavelength Pyrometer

Liang, Mei ; Sun, Zhuo ; Wang, Changhui

IEEE sensors journal, 2024-07, Vol.24 (13), p.21191-21199 [Periódico revisado por pares]

New York: IEEE

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