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Feasibility of a kneeling train to improve platform–train interface for passenger boarding and alighting
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Feasibility of a kneeling train to improve platform–train interface for passenger boarding and alighting

Ambur, Ramakrishnan ; Hubbard, Peter ; Cooke, John ; Barnard, Simon

IET intelligent transport systems, 2020-10, Vol.14 (10), p.1163-1170 [Periódico revisado por pares]

The Institution of Engineering and Technology

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Reliable write assist low power SRAM cell for wireless sensor network applications
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Reliable write assist low power SRAM cell for wireless sensor network applications

Pal, Soumitra ; Bose, Subhankar ; Ki, Wing-Hung ; Islam, Aminul

IET circuits, devices & systems, 2020-03, Vol.14 (2), p.137-147 [Periódico revisado por pares]

The Institution of Engineering and Technology

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3
Low-Cost Concurrent Error Detection for Floating-Point Unit (FPU) Controllers
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Low-Cost Concurrent Error Detection for Floating-Point Unit (FPU) Controllers

Maniatakos, M. ; Kudva, P. ; Fleischer, B. M. ; Makris, Y.

IEEE transactions on computers, 2013-07, Vol.62 (7), p.1376-1388 [Periódico revisado por pares]

IEEE

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4
Review and retrofitted architectures to form reliable smart microgrid networks for urban buildings
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Review and retrofitted architectures to form reliable smart microgrid networks for urban buildings

Pavan Kumar, Y.V ; Bhimasingu, Ravikumar

IET networks, 2015-11, Vol.4 (6), p.338-349 [Periódico revisado por pares]

The Institution of Engineering and Technology

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5
Spam and the social-technical gap
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Artigo
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Spam and the social-technical gap

Whitworth, B. ; Whitworth, E.

Computer (Long Beach, Calif.), 2004-10, Vol.37 (10), p.38-45 [Periódico revisado por pares]

New York: IEEE

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6
It Is What It Is Because It Was What It Was
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It Is What It Is Because It Was What It Was

Booch, G.

IEEE software, 2007-01, Vol.24 (1), p.14-15 [Periódico revisado por pares]

Los Alamitos: IEEE

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7
Collaborative Modes of Curating Software
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magazinearticle
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Collaborative Modes of Curating Software

Murchu, Nora O'

IEEE multimedia, 2015-01, Vol.22 (1), p.88-92 [Periódico revisado por pares]

New York: IEEE

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