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1 |
Material Type: Artigo
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In-chip microstructures and photonic devices fabricated by nonlinear laser lithography deep inside siliconTokel, Onur ; Turnali, Ahmet ; Makey, Ghaith ; Elahi, Parviz ; Çolakoğlu, Tahir ; Ergeçen, Emre ; Yavuz, Özgün ; Hübner, René ; Borra, Mona Zolfaghari ; Pavlov, Ihor ; Bek, Alpan ; Turan, Raşit ; Kesim, Denizhan Koray ; Tozburun, Serhat ; Ilday, Serim ; Ilday, F ÖmerNature photonics, 2017-10, Vol.11 (10), p.639-645 [Periódico revisado por pares]England: Nature Publishing GroupTexto completo disponível |
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Material Type: Artigo
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Reducing intrinsic loss in superconducting resonators by surface treatment and deep etching of silicon substratesBruno, A. ; de Lange, G. ; Asaad, S. ; van der Enden, K. L. ; Langford, N. K. ; DiCarlo, L.Applied physics letters, 2015-05, Vol.106 (18) [Periódico revisado por pares]Melville: American Institute of PhysicsTexto completo disponível |
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Material Type: Artigo
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Tuning the thickness of exfoliated quasi-two-dimensional β-Ga2O3 flakes by plasma etchingKwon, Yongbeom ; Lee, Geonyeop ; Oh, Sooyeoun ; Kim, Jihyun ; Pearton, Stephen J. ; Ren, FanApplied physics letters, 2017-03, Vol.110 (13) [Periódico revisado por pares]Melville: American Institute of PhysicsTexto completo disponível |
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Material Type: Artigo
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Fabrication of Novel MEMS Microgrippers by Deep Reactive Ion Etching With Metal Hard MaskBagolini, Alvise ; Ronchin, Sabina ; Bellutti, Pierluigi ; Chiste, Matteo ; Verotti, Matteo ; Belfiore, Nicola PioJournal of microelectromechanical systems, 2017-08, Vol.26 (4), p.926-934 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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Ultra Deep Reactive Ion Etching of High Aspect-Ratio and Thick Silicon Using a Ramped-Parameter ProcessTang, Yemin ; Sandoughsaz, Amin ; Owen, Kevin J. ; Najafi, KhalilJournal of microelectromechanical systems, 2018-08, Vol.27 (4), p.686-697 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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On-chip microfluidic production of cell-sized liposomesDeshpande, Siddharth ; Dekker, CeesNature protocols, 2018-05, Vol.13 (5), p.856-874 [Periódico revisado por pares]England: Nature Publishing GroupTexto completo disponível |
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Material Type: Artigo
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Micromachined Packaging for Terahertz SystemsChattopadhyay, Goutam ; Reck, Theodore ; Lee, Choonsup ; Jung-Kubiak, CecileProceedings of the IEEE, 2017-06, Vol.105 (6), p.1139-1150 [Periódico revisado por pares]New York: IEEETexto completo disponível |
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Material Type: Artigo
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Phenomenological model for predicting C x H y F z + ion etching yields of SiO2 and SiN x substratesKawamoto, Akiko ; Kataoka, Junji ; Kuboi, Shuichi ; Sasaki, Toshiyuki ; Tamaoki, NaokiJapanese Journal of Applied Physics, 2023-07, Vol.62 (SI) [Periódico revisado por pares]IOP PublishingTexto completo disponível |
9 |
Material Type: Artigo
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In-plane silicon microneedles with open capillary microfluidic networks by deep reactive ion etching and sacrificial layer based sharpeningLi, Yan ; Zhang, Hang ; Yang, Ruifeng ; Tazrin, Fahima ; Zhu, Chenxu ; Kaddoura, Moufeed ; Blondeel, Eric J.M. ; Cui, BoSensors and actuators. A. Physical., 2019-06, Vol.292, p.149-157 [Periódico revisado por pares]Lausanne: Elsevier B.VTexto completo disponível |
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Material Type: Artigo
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The structural and optical properties of black silicon by inductively coupled plasma reactive ion etchingSteglich, Martin ; Käsebier, Thomas ; Zilk, Matthias ; Pertsch, Thomas ; Kley, Ernst-Bernhard ; Tünnermann, AndreasJournal of applied physics, 2014-11, Vol.116 (17) [Periódico revisado por pares]Melville: American Institute of PhysicsTexto completo disponível |