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Effects of Zn additions on the structure of the soldered Sn-3.5Ag and Cu interfacesXu, R.L ; Liu, Y.C ; Wei, C ; Yu, L.MSoldering & surface mount technology, 2010-01, Vol.22 (2), p.13-20 [Revista revisada por pares]Bradford: Emerald Publishing LimitedTexto completo disponible |