Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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Identification of elasto-viscoplastic material parameters by indentation testing and combined finite element modelling and numerical optimizationRauchs, G. ; Bardon, J.Finite elements in analysis and design, 2011-07, Vol.47 (7), p.653-667 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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2 |
Material Type: Artigo
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Identification of the material parameters of a viscous hyperelastic constitutive law from spherical indentation tests of rubber and validation by tensile testsRauchs, G. ; Bardon, J. ; Georges, D.Mechanics of materials, 2010-11, Vol.42 (11), p.961-973 [Periódico revisado por pares]Kidlington: Elsevier LtdTexto completo disponível |
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3 |
Material Type: Artigo
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Influence of plasma surface treatment on bond strength behaviour of an adhesively bonded aluminium-epoxy systemSperandio, C. ; Bardon, J. ; Laachachi, A. ; Aubriet, H. ; Ruch, D.International journal of adhesion and adhesives, 2010-12, Vol.30 (8), p.720-728 [Periódico revisado por pares]Kidlington: Elsevier LtdTexto completo disponível |
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4 |
Material Type: Artigo
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Estimation of thermal contact resistance during the first stages of metal solidification process : I-experiment principle and modelisationLOULOU, T ; ARTYUKHIN, E. A ; BARDON, J. PInternational journal of heat and mass transfer, 1999-06, Vol.42 (12), p.2119-2127 [Periódico revisado por pares]Oxford: ElsevierTexto completo disponível |
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5 |
Material Type: Artigo
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A general optimization method using adjoint equation for solving multidimensional inverse heat conductionJarny, Y. ; Ozisik, M.N. ; Bardon, J.P.International journal of heat and mass transfer, 1991, Vol.34 (11), p.2911-2919 [Periódico revisado por pares]Oxford: Elsevier LtdTexto completo disponível |
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6 |
Material Type: Artigo
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Experimental route to heat conduction beyond the Fourier equationGuillemet, P. ; Bardon, J.P. ; Rauch, C.International journal of heat and mass transfer, 1997-10, Vol.40 (17), p.4043-4053 [Periódico revisado por pares]Oxford: Elsevier LtdTexto completo disponível |
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7 |
Material Type: Artigo
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Correlation between the adhesion and the thermal contact resistance: effects of substrate surface ion bombardment etchingLahmar, A ; Hmina, N ; Scudeller, Y ; Bardon, J.PThin solid films, 1998-07, Vol.325 (1), p.156-162 [Periódico revisado por pares]Lausanne: Elsevier B.VTexto completo disponível |
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8 |
Material Type: Artigo
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Imaging charged objects using low-energy-electron coherent beamsGeorges, V. ; Bardon, J. ; Degiovanni, A. ; Morin, R.Ultramicroscopy, 2001-11, Vol.90 (1), p.33-38 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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9 |
Material Type: Artigo
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Conducting, semiconducting and insulating objects observed by low-energy electron holographyBardon, J ; Degiovanni, A ; Georges, V ; Morin, RUltramicroscopy, 2002-08, Vol.92 (3), p.133-142 [Periódico revisado por pares]Amsterdam: Elsevier B.VTexto completo disponível |
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10 |
Material Type: Artigo
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Thermal contact resistance and adhesion studies on thin copper films on alumina substratesSakami, D. ; Lahmar, A. ; Scudeller, Y. ; Danes, F. ; Bardon, J. P.Journal of adhesion science and technology, 2001-01, Vol.15 (12), p.1403-1416 [Periódico revisado por pares]Leiden: Taylor & Francis GroupTexto completo disponível |