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Material Type: Artigo
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Recent Advances in Host–Guest Self‐Assembled Cyclodextrin Carriers: Implications for Responsive Drug Delivery and Biomedical EngineeringWankar, Jitendra ; Kotla, Niranjan G. ; Gera, Sonia ; Rasala, Swetha ; Pandit, Abhay ; Rochev, Yury A.Advanced functional materials, 2020-10, Vol.30 (44), p.n/a [Periódico revisado por pares]Hoboken: Wiley Subscription Services, IncTexto completo disponível |
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Material Type: Livro
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Numerical Methods in Biomedical EngineeringStanley Martin Dunn A Constantinides; Alkis Constantinides; Prabhas V Moghe; Prabhas V. Moghe Alkis Constantinides Moghe,Prabhas Prabhas Moghe Prabhas V. Moghe; Stanley Constantinides,Alkis Moghe,Prabhas DunnBurlington Academic Press 2006Acesso online. A biblioteca também possui exemplares impressos. |
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Material Type: Artigo
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“Plasmonic Nanomaterials”: An emerging avenue in biomedical and biomedical engineering opportunitiesBorghei, Yasaman-Sadat ; Hosseinkhani, Saman ; Ganjali, Mohammad RezaJournal of advanced research, 2022-07, Vol.39, p.61-71 [Periódico revisado por pares]Elsevier B.VTexto completo disponível |
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Material Type: Livro
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Advances in Biomedical EngineeringJ. H. U. Brown James F DicksonAcademic Press 1972Acesso online. A biblioteca também possui exemplares impressos. |
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Material Type: Livro
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The Fourier Transform in Biomedical EngineeringJohn J. Peters, Terry M. Williams, Jackie Benedetto Terry M Peters; Jackie Williams; Jacqueline C WilliamsBirkhäuser Boston 1998Acesso online. A biblioteca também possui exemplares impressos. |
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Material Type: Artigo
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Refined Composite Multiscale Dispersion Entropy and its Application to Biomedical SignalsAzami, Hamed ; Rostaghi, Mostafa ; Abasolo, Daniel ; Escudero, JavierIEEE transactions on biomedical engineering, 2017-12, Vol.64 (12), p.2872-2879 [Periódico revisado por pares]United States: IEEETexto completo disponível |
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Material Type: Artigo
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IEEE Transactions on Biomedical Engineering Handling Editors InformationIEEE transactions on biomedical engineering, 2024-04, Vol.71 (4), p.C4-C4 [Periódico revisado por pares]New York: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)Texto completo disponível |
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Material Type: Artigo
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IEEE Transactions on Biomedical Engineering Information for AuthorsIEEE transactions on biomedical engineering, 2024-04, Vol.71 (4), p.C3-C3 [Periódico revisado por pares]New York: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)Texto completo disponível |
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Material Type: Artigo
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IEEE Transactions on Biomedical Engineering Handling EditorsIEEE transactions on biomedical engineering, 2024-02, Vol.71 (2), p.C4-C4 [Periódico revisado por pares]New York: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)Texto completo disponível |
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Material Type: Artigo
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IEEE Transactions on Biomedical Engineering Handling Editors InformationIEEE transactions on biomedical engineering, 2024-03, Vol.71 (3), p.C4-C4 [Periódico revisado por pares]New York: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)Texto completo disponível |