Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
---|---|---|---|
1 |
Material Type: Artigo
|
![]() |
Feasibility of a kneeling train to improve platform–train interface for passenger boarding and alightingAmbur, Ramakrishnan ; Hubbard, Peter ; Cooke, John ; Barnard, SimonIET intelligent transport systems, 2020-10, Vol.14 (10), p.1163-1170 [Periódico revisado por pares]The Institution of Engineering and TechnologyTexto completo disponível |
2 |
Material Type: Artigo
|
![]() |
It Is What It Is Because It Was What It WasBooch, G.IEEE software, 2007-01, Vol.24 (1), p.14-15 [Periódico revisado por pares]Los Alamitos: IEEETexto completo disponível |
3 |
Material Type: Artigo
|
![]() |
Low-Cost Concurrent Error Detection for Floating-Point Unit (FPU) ControllersManiatakos, M. ; Kudva, P. ; Fleischer, B. M. ; Makris, Y.IEEE transactions on computers, 2013-07, Vol.62 (7), p.1376-1388 [Periódico revisado por pares]IEEETexto completo disponível |
4 |
Material Type: magazinearticle
|
![]() |
Collaborative Modes of Curating SoftwareMurchu, Nora O'IEEE multimedia, 2015-01, Vol.22 (1), p.88-92 [Periódico revisado por pares]New York: IEEETexto completo disponível |
5 |
Material Type: Artigo
|
![]() |
Reliable write assist low power SRAM cell for wireless sensor network applicationsPal, Soumitra ; Bose, Subhankar ; Ki, Wing-Hung ; Islam, AminulIET circuits, devices & systems, 2020-03, Vol.14 (2), p.137-147 [Periódico revisado por pares]Stevenage: The Institution of Engineering and TechnologyTexto completo disponível |
6 |
Material Type: Artigo
|
![]() |
Review and retrofitted architectures to form reliable smart microgrid networks for urban buildingsPavan Kumar, Y.V ; Bhimasingu, RavikumarIET networks, 2015-11, Vol.4 (6), p.338-349 [Periódico revisado por pares]The Institution of Engineering and TechnologyTexto completo disponível |
7 |
Material Type: Artigo
|
![]() |
Spam and the social-technical gapWhitworth, B. ; Whitworth, E.Computer (Long Beach, Calif.), 2004-10, Vol.37 (10), p.38-45 [Periódico revisado por pares]New York: IEEETexto completo disponível |