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1 |
Material Type: Article
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Aligned deposition of bottom-up grown nanowires by two-directional pressure-controlled contact printingSalimitari, P ; Behroudj, A ; Strehle, SNanotechnology, 2022-06, Vol.33 (23), p.235301 [Peer Reviewed Journal]England: IOP PublishingFull text available |
2 |
Material Type: Article
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Exploring nanowire regrowth for the integration of bottom-up grown silicon nanowires into AFM scanning probesBehroudj, A ; Salimitari, P ; Nilsen, M ; Strehle, SJournal of micromechanics and microengineering, 2021-05, Vol.31 (5), p.55010 [Peer Reviewed Journal]Full text available |
3 |
Material Type: Article
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Surface-controlled contact printing for nanowire device fabrication on a large scaleRoßkopf, D ; Strehle, SNanotechnology, 2016-05, Vol.27 (18), p.185301-185301 [Peer Reviewed Journal]England: IOP PublishingFull text available |
4 |
Material Type: Article
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Thermal oxidation synthesis of crystalline iron-oxide nanowires on low-cost steel substrates for solar water splittingDlugosch, T ; Chnani, A ; Muralidhar, P ; Schirmer, A ; Biskupek, J ; Strehle, SSemiconductor science and technology, 2017-08, Vol.32 (8), p.84001 [Peer Reviewed Journal]IOP PublishingFull text available |
5 |
Material Type: Article
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The mechanisms of platinum-catalyzed silicon nanowire growthHibst, N ; Knittel, P ; Biskupek, J ; Kranz, C ; Mizaikoff, B ; Strehle, SSemiconductor science and technology, 2015-12, Vol.31 (2), p.25005 [Peer Reviewed Journal]IOP PublishingFull text available |
6 |
Material Type: Article
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Beam-deposited platinum as versatile catalyst for bottom-up silicon nanowire synthesisHibst, N. ; Knittel, P. ; Kranz, C. ; Mizaikoff, B. ; Strehle, S.Applied physics letters, 2014-10, Vol.105 (15) [Peer Reviewed Journal]Melville: American Institute of PhysicsFull text available |
7 |
Material Type: Article
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Electrical properties of electroplated Cu(Ag) thin filmsStrehle, S. ; Bartha, J.W. ; Wetzig, K.Thin solid films, 2009-04, Vol.517 (11), p.3320-3325 [Peer Reviewed Journal]Amsterdam: Elsevier B.VFull text available |
8 |
Material Type: Article
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Electroplating of Cu(Ag) thin films for interconnect applicationsStrehle, S. ; Menzel, S. ; Bartha, J.W. ; Wetzig, K.Microelectronic engineering, 2010-02, Vol.87 (2), p.180-186 [Peer Reviewed Journal]Amsterdam: Elsevier B.VFull text available |
9 |
Material Type: Article
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Electrical Evaluation of Ru–W(-N), Ru–Ta(-N) and Ru–Mn films as Cu diffusion barriersWojcik, H. ; Kaltofen, R. ; Merkel, U. ; Krien, C. ; Strehle, S. ; Gluch, J. ; Knaut, M. ; Wenzel, C. ; Preusse, A. ; Bartha, J.W. ; Geidel, M. ; Adolphi, B. ; Neumann, V. ; Liske, R. ; Munnik, F.Microelectronic engineering, 2012-04, Vol.92, p.71-75 [Peer Reviewed Journal]Amsterdam: Elsevier B.VFull text available |
10 |
Material Type: Article
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Microstructure of electroplated Cu(Ag) alloy thin filmsStrehle, S. ; Menzel, S. ; Wetzig, K. ; Bartha, J.W.Thin solid films, 2011-03, Vol.519 (11), p.3522-3529 [Peer Reviewed Journal]Amsterdam: Elsevier B.VFull text available |